3nm

Taiwan Semiconductor Manufacturing Co. on Thursday kicked off its 2022 TSMC Technology Symposium, where the company traditionally shares it process technology roadmaps as well as its future expansion plans. One of the key things that TSMC is announcing today are its leading-edge nodes that belong to its N3 (3 nm class) and N2 (2nm class) families that will be used to make advanced CPUs, GPUs, and SoCs in the coming years. N3: Five Nodes Over Next Three Years As fabrication processes get more complex, their pathfinding, research, and development times get stretched out as well, so we no longer see a brand-new node emerging every two years from TSMC and other foundries. With N3, TSMC's new node introduction cadence is going to expand to around 2.5...

GlobalFoundries Gives 7 nm Capacity Update, Mulls Skipping 5 nm

High-ranking executives of GlobalFoundries this month gave several updates concerning future plans of the contract maker of semiconductors. As it appears, in a bid to provide more tangible advantages...

19 by Anton Shilov on 5/31/2018

Samsung Foundry Roadmap: EUV-Based 7LPP for 2018, 3 nm Incoming

Samsung Foundry this week updated its fabrication technology roadmap, introducing a number of changes and announcing the first details about its 3 nm manufacturing process that is several years...

25 by Anton Shilov on 5/24/2018

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