When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two new cutting-edge fab techniques: gate-all-around transistors, and backside power rails. But, as we've since learned from last week's EU symposium, TSMC's plans are a bit more nuanced than first announced. Unlike some of their rivals, TSMC will not be implementing both technologies in the initial version of their N2 node. Instead, the first iteration of N2 will only be implementing gate-all-around transistors, with backside power delivery to come with a later version of the node. So far, TSMC has mentioned two distinctive features of N2: nano sheet gate-all-around (GAA) transistors, and backside power rails. GAA transistors...
At its 2022 Technology Symposium, TSMC formally unveiled its N2 (2 nm class) fabrication technology, which is slated to go into production some time in 2025 and will be...19 by Anton Shilov on 6/16/2022
Taiwan Semiconductor Manufacturing Co. has solid plans for the next few years, but the foundry's manufacturing technology design cycles are getting longer. As a result, to address all of...21 by Anton Shilov on 4/22/2022
TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting...32 by Anton Shilov on 10/18/2021
TSMC this week has announced plans to spend $100 billion on new production facilities as well as R&D over the next three years. The world's largest contract maker of...45 by Anton Shilov on 4/2/2021
SMIC first started volume production of chips using its 14 nm FinFET fabrication process in Q4 2019. Since then, the company has been hard at work developing its next...20 by Anton Shilov on 3/23/2020