CPUs
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
Intel Announces 14th Gen Core Series For Desktop: Core i9-14900K, Core i7-14700K and Core i5-14600K
Ahead of tomorrow's full-scale launch, Intel this afternoon is pre-announcing their 14th Generation Core desktop processors. Aptly codenamed Raptor Lake Refresh, these new chips are based on Intel's existing...
30 by Gavin Bonshor on 10/16/2023
Samsung Lines Up First Server Customer For 3nm Fabs
Although Samsung Foundry was the first contract fab to formally start mass production of chips on a 3 nm-class process, so far, the company's latest process has largely been...
5 by Anton Shilov on 10/12/2023
Tenstorrent to Use Samsung’s SF4X for Quasar Low-Cost AI Chiplet
Tenstorrent this week announced that it had chosen to use Samsung's SF4X (4 nm-class) process technology for its upcoming low-cost, low-power codenamed Quasar chiplet for machine learning workloads. The...
13 by Anton Shilov on 10/3/2023
Intel Meteor Lake SoC is NOT Coming to Desktops: Well, Not Technically
Over the last couple of days, numerous reports have revealed that Intel's recently announced Meteor Lake SoC, primarily a mobile platform, would be coming to desktop PCs. Intel has...
18 by Gavin Bonshor on 9/28/2023
Intel High-NA Lithography Update: Dev Work On Intel 18A, Production On Future Node
As part of Intel’s suite of hardware announcements at this year’s Intel Innovation 2023 conference, the company offered a brief update on their plans for High-NA EUV machines, which...
24 by Ryan Smith on 9/20/2023
Intel Announces Panther Lake Client Platform, Built on Intel 18A For 2025
While the primary focus has been on Intel's impending Meteor Lake SoC due by the end of the year, Intel CEO Pat Gelsinger unveiled more about their current client...
8 by Gavin Bonshor on 9/20/2023
Intel Demos Lunar Lake Client Processor In Action, Silicon Pulled In To Intel 20A?
As part of Intel’s Innovation 2023 conference, the company is not only showing off their current and soon-to-be-current products like Meteor Lake, but the forward-looking keynote by CEO Pat...
9 by Ryan Smith on 9/19/2023
Intel Unveils Meteor Lake Architecture: Intel 4 Heralds the Disaggregated Future of Mobile CPUs
During the opening keynote at Intel's Innovation event in San Jose, Chief Executive Officer Pat Gelsinger unveiled a score of details about the upcoming Meteor Lake client platform. Intel's...
108 by Gavin Bonshor on 9/19/2023
The Intel Innovation 2023 Keynote Live Blog (8:30am PT, 15:30 UTC)
Kicking off this morning is Intel's annual technology conference, Innovation. The second year of the revived show once again has Intel's CEO Pat Gelsinger leading things off, with what's...
9 by Ryan Smith & Gavin Bonshor on 9/19/2023
Intel Shows Off Work on Next-Gen Glass Core Substrates, Plans Deployment Later in Decade
Although Intel’s annual Innovation event doesn’t kick off until tomorrow, the company is already publishing some announcements ahead of the show – and it’s not the trivial stuff, either...
17 by Ryan Smith on 9/18/2023
AMD Releases EPYC 8004 "Siena" CPUs: Zen 4c For Edge-Optimized Server Chips
AMD this morning is releasing the fourth and final member of its 4th generation EPYC processor family, the EPYC 8004 series. Previously disclosed under the codename Siena, the EPYC...
5 by Ryan Smith on 9/18/2023
Arm's Clients and Partners Signal Interest to Invest $735 Million Ahead of IPO
According to fresh SEC filings from Arm, the chip IP designer has secured a slew of industry investors ahead of the company's impending IPO. Aiming for a strong start...
5 by Anton Shilov on 9/6/2023
Hot Chips 2023: Intel Details More on Granite Rapids and Sierra Forest Xeons
With the annual Hot Chips conference taking place this week, many of the industry’s biggest chip design firms are at the show, talking about their latest and/or upcoming wares...
19 by Ryan Smith on 8/28/2023
Synopsys Surpasses $500M/Year in AI Chip Revenue, Expects Further Rapid Growth
Demand for generative artificial intelligence (AI) applications is so high that NVIDIA's high-performance compute GPUs like A100 and H100 are reportedly sold out for quarters to come. Dozens of...
5 by Anton Shilov on 8/22/2023
Arm to Be Public Once More, Files for IPO on Nasdaq
The ongoing saga of ownership of Arm appears to be finally nearing its end, as Arm has announced this afternoon that the company has made its long-awaited filing for...
16 by Ryan Smith on 8/21/2023
Intel Cuts Some R&D Positions in California to Reduce Costs
As Intel continues to refocus on its core competencies, the company has been no stranger to shedding business units and jobs in the process. And while the roughly 132,000...
12 by Anton Shilov on 8/18/2023
PCI-SIG Forms Optical Workgroup - Lighting The Way To PCIe's Future
The PCI-Express interconnect standard may be going through some major changes in the coming years, based on a new announcement from the group responsible for the standard. The PCI-SIG...
16 by Ryan Smith on 8/2/2023
AMD Announces Ryzen 9 7945HX3D: Ryzen Mobile Gets 3D V-Cache
For this year's ChinaJoy expo, AMD is taking to the show to announce a new and very special mobile CPU for high-end, desktop replacement-class laptops: the Ryzen 9 7945HX3D...
51 by Gavin Bonshor on 7/27/2023
Intel Unveils AVX10 and APX Instruction Sets: Unifying AVX-512 For Hybrid Architectures
Intel has announced two new x86-64 instruction sets designed to bolster and offer more performance in AVX-based workloads with their hybrid architecture of performance (P) and efficiency (E) cores...
27 by Gavin Bonshor on 7/25/2023
AMD Launches Ryzen 5 7500F in China: Zen 4 With no Integrated Graphics
Over the weekend, AMD officially listed the Ryzen 5 7500F processor on their website. Although initial reports pointed towards a China-only release, and at present, that much is true...
9 by Gavin Bonshor on 7/24/2023
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