CPUs

The big notebook launch for Intel this year is Tiger Lake, its upcoming 10nm platform designed to pair a new graphics architecture with a nice high frequency for the performance that customers in this space require. Over the past few weeks, we’ve covered the microarchitecture as presented by Intel at its latest Intel Architecture Day 2020, as well as the formal launch of the new platform in early September. The missing piece of the puzzle was actually testing it, to see if it can match the very progressive platform currently offered by AMD’s Ryzen Mobile. Today is that review, with one of Intel’s reference design laptops.

AMD Preps Second Round of HPC System Donations For COVID-19 Research

When things aren’t blowing up or burning down as of late, there’s still the matter of the ongoing COVID-19 pandemic. While the first generation of vaccines move carefully closer...

17 by Ryan Smith 6 days ago

It’s Official: NVIDIA To Acquire Arm For $40 Billion

Following a number of rumors and leaks, NVIDIA this evening announced that it is buying Arm Limited for $40 billion. The cash and stock deal will see NVIDIA buy...

140 by Ryan Smith on 9/13/2020

AMD Announces Ryzen "Zen 3" and Radeon "RDNA2" Presentations for October: A New Journey Begins

AMD today has announced that they will be making a pair of consumer product presentations in October. The chipmaker, who has been fairly quiet since the spring, will be...

147 by Ryan Smith on 9/9/2020

Intel Launches 11th Gen Core Tiger Lake: Up to 4.8 GHz at 50 W, 2x GPU with Xe, New Branding

In August, Intel ran one of its rare Architecture Days where the company went into some detail about its upcoming Tiger Lake processor. This included target markets, core counts...

349 by Dr. Ian Cutress on 9/2/2020

Intel Launches Tiger Lake: A Live Blog (Noon ET, 9am PT)

Intel is about to launch Tiger Lake. Follow along with our Live Blog!

57 by Dr. Ian Cutress on 9/2/2020

3DFabric: The Home for TSMC’s 2.5D and 3D Stacking Roadmap

Interposers. EMIB. Foveros. Die-to-die stacking. ODI. AIB.TSVs. All these words and acronyms have one overriding feature – they are all involved in how two bits of silicon physically connect...

15 by Dr. Ian Cutress on 9/2/2020

Best CPUs for Gaming: August 2020

Sometimes choosing a CPU is hard. So we've got you covered. In our CPU Guides, we give you our pick of some of the best processors available, supplying data...

22 by Dr. Ian Cutress on 8/31/2020

Marvell Refocuses Thunder Server Platforms Towards Custom Silicon Business

Yesterday during Marvell’s quarterly earnings call, the company had made a surprise announcement that they are planning to restructure their server processor development team towards fully custom solutions, abandoning...

43 by Andrei Frumusanu on 8/28/2020

TSMC Launches New N12e Process: FinFET at 0.4V for IoT

One of the main drivers for the semiconductor industry is the growth in always-connected devices that require silicon inside, either for compute, communication, or control. The ‘Internet of Things&rsquo...

27 by Dr. Ian Cutress on 8/27/2020

Where are my GAA-FETs? TSMC to Stay with FinFET for 3nm

As we passed that 22nm to 16nm barrier, almost all the major semiconductor fabrication companies on the leading edge transitioned from planar transistors to FinFET transistors. The benefits of...

36 by Dr. Ian Cutress on 8/26/2020

TSMC Expects 5nm to be 11% of 2020 Wafer Production (sub 16nm)

One of the measures of how quickly a new process node gains traction is by comparing how many wafers are in production, especially as that new process node goes...

12 by Dr. Ian Cutress on 8/25/2020

TSMC Teases 12-High 3D Stacked Silicon: SoIC Goes Extreme

I’ve maintained for a couple of years now that the future battleground when it comes to next-generation silicon is going to be in the interconnect – implicitly this relies...

16 by Dr. Ian Cutress on 8/25/2020

TSMC Updates on Node Availability Beyond Logic: Analog, HV, Sensors, RF

Most of the time when we speak about semiconductor processes, we are focused on the leading edge of what is possible. Almost exclusively that leading edge is designed for...

2 by Dr. Ian Cutress on 8/25/2020

‘Better Yield on 5nm than 7nm’: TSMC Update on Defect Rates for N5

One of the key metrics on how well a semiconductor process is developing is looking at its quantitative chip yield – or rather, its defect density. A manufacturing process...

107 by Dr. Ian Cutress on 8/25/2020

Intel Moving to Chiplets: ‘Client 2.0’ for 7nm

One of the more esoteric elements of Intel’s Architecture Day 2020 came very near the end, where Intel spent a few minutes discussing what it believes is the future...

68 by Dr. Ian Cutress on 8/21/2020

342 Transistors for Every Person In the World: Cerebras 2nd Gen Wafer Scale Engine Teased

One of the highlights of Hot Chips from 2019 was the startup Cerebras showcasing its product – a large ‘wafer-scale’ AI chip that was literally the size of a...

32 by Dr. Ian Cutress on 8/18/2020

Hot Chips 2020 Live Blog: Microsoft Xbox Series X System Architecture (6:00pm PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

59 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: Alibaba Xuantie-910 RISC-V CPU (3:00pm PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

6 by Dr. Ian Cutress on 8/17/2020

Hot Chips 2020 Live Blog: Intel's Raja Koduri Keynote (2:00pm PT)

Hot Chips has gone virtual this year! Lots of talks on lots of products, including Tiger Lake, Xe, POWER10, Xbox Series X, TPUv3, and a special Raja Koduri Keynote...

20 by Dr. Ian Cutress on 8/17/2020

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