DRAM

Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated to offer 25% better performance and 30% greater capacity compared to existing mobile DRAM devices from the company. The new chips also appear to be tangibly faster than Micron's LPDDR5X memory and SK hynix's LPDDR5T chips. Samsung's forthcoming LPDDR5X devices feature a data transfer rate of 10.7 GT/s as well as maximum capacity per stack of 32 GB. This allows Samsung's clients to equip their latest smartphones or laptops with 32 GB of low-power memory using just one DRAM package, which greatly simplifies their designs. Samsung says that 32 GB of memory will be particularly beneficial...

XPG Spectrix D50 Memory: A More Subtle RGB DDR4

ADATA's XPG division has unveiled its latest addition in the high-performance DRAM segment, the Spectrix D50. Starting from 8 GB DDR4-3000 modules, the latest Spectrix D50 kits will go...

22 by Gavin Bonshor on 4/15/2020

ADATA's New 32 GB DDR4-3200 SO-DIMM, Ideal for Ryzen Mobile

ADATA, one of the leading manufacturers of DRAM and NAND products, has just unveiled its latest memory modules. The new ADATA DDR4-3200 32 GB parts are available in both...

41 by Gavin Bonshor on 4/15/2020

SK Hynix: We're Planning for DDR5-8400 at 1.1 Volts

Back in November last year, we reported that SK Hynix had developed and deployed its first DDR5 DRAM. Fast forward to the present, and we also know SK Hynix...

86 by Gavin Bonshor on 4/3/2020

Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development

JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...

20 by Anton Shilov on 3/27/2020

TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules

One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...

7 by Gavin Bonshor on 3/27/2020

Micron to Launch HBM2 DRAM This Year: Finally

Bundled in their latest earnings call, Micron has revealed that later this year the company will finally introduce its first HBM DRAM for bandwidth-hungry applications. The move will enable...

14 by Anton Shilov on 3/27/2020

Samsung to Produce DDR5 in 2021 (with EUV)

Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...

20 by Anton Shilov on 3/25/2020

Micron Develops uMCP with LPDDR5 & 96L 3D NAND for Midrange 5G Smartphones

Micron this week has announced that it has started sampling the industry’s first multichip package (MCP) that integrates LPDDR5-6400 DRAM and 96-layer 3D NAND flash memory. The uMCP5 device...

11 by Anton Shilov on 3/11/2020

Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus

The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...

42 by Anton Shilov on 3/6/2020

GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit

GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...

23 by Anton Shilov on 2/6/2020

JEDEC Updates HBM2 Memory Standard To 3.2 Gbps; Samsung's Flashbolt Memory Nears Production

After a series of piecemeal announcements from different hardware vendors over the past year, the future of High Bandwidth Memory 2 (HBM2) is finally coming into focus. Continuing the...

24 by Ryan Smith on 2/3/2020

SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020

Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...

6 by Anton Shilov on 2/3/2020

The Corsair DDR4-5000 Vengeance LPX Review: Super-Binned, Super Exclusive

The consumer memory industry has been teasing DDR4-5000 for a few months now. We saw one company show some DDR4-5000 modules at Computex back in July 2019, running...

56 by Gavin Bonshor on 1/27/2020

Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM

Just like all major makers of DRAM, SK Hynix produced its first DDR5 memory chips a couple of years ago and has been experimenting with the technology since then...

39 by Anton Shilov on 1/13/2020

DRAMeXchange: Blackout at Samsung’s Fab Will Not Affect Commodity DRAM Prices in Q1

Following a power outage and consequent disruption of production at Samsung’s Line 13 fab in Hwaseong, South Korea, back on December 31, 2019, there had been some concerns about...

5 by Anton Shilov on 1/9/2020

CES 2020: Micron Begins to Sample DDR5 RDIMMs with Server Partners

Micron announced at CES that it had started sampling of its DDR5 Registered DIMMs with select partners. The very fact that Micron started sampling of DDR5 modules indicates that...

7 by Anton Shilov on 1/7/2020

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

19 by Dr. Ian Cutress on 1/3/2020

Samsung’s Fab in Hwaseong Suffers Power Outage

Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...

48 by Anton Shilov on 1/2/2020

Micron Obtains License to Sell DRAM & NAND to Huawei

The inclusion of Huawei into the U.S. Department of Commerce’s Entity List and consequent restrictions to work with the Chinese giant clearly made it much harder for the U.S.-based...

12 by Anton Shilov on 12/19/2019

ChangXin Memory Technologies (CXMT) is Ramping up Chinese DRAM Using Qimonda IP

ChangXin Memory Technologies (CXMT), previously known as Innotron, has started production of computer memory using a 19 nm manufacturing technology. The company has a roadmap for at least two...

15 by Anton Shilov on 12/2/2019

Log in

Don't have an account? Sign up now