Memory
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are going to need to adopt more advanced packaging methods than are used today to accommodate the wider memory. As part of its European Technology Symposium 2024 presentation, TSMC offered some fresh details into the base dies it will be manufacturing for HBM4, which will be built using logic processes. With TSMC planning to employ variations of their N12 and N5 processes for this task, the company is expecting to occupy a favorable place in the...
Corsair 192 GB DDR4 kits for W-3175X Listed Online: Up to $3000
Corsair has released a range of 192 GB DDR4 kits to complement the workstation-focused Intel Xeon W-3175X processor which features 28 cores. The top kit from the new line-up...
9 by Gavin Bonshor on 2/12/2019
Keysight Reveals DDR5 Testing & Validation System
Keysight, an electronic measurement company, has introduced the industry’s first off-the-shelf testing and validation system for DDR5 DRAM. The N6475A DDR5 Tx compliance test software is aimed at developers...
23 by Anton Shilov on 2/6/2019
G.Skill Unveils Trident Z Royal Hexa-Channel 192 GB DDR4-4000 Kit for Xeon W-3175X
G.Skill has released the industry’s first hexa-channel DDR4 memory kits designed specifically for Intel’s 28-core Xeon W-3175X processor for extreme workstations. The top-of-the-range kit features a 192 GB capacity...
15 by Anton Shilov on 1/30/2019
GIGABYTE Adds Support for 128 GB of Memory to Z390 & C246 Motherboards
GIGABYTE has released UEFI BIOS updates for its motherboards based on Intel’s C246 and Z390 chipsets that enable support for 32 GB unbuffered memory modules from Samsung. This enables...
28 by Anton Shilov on 1/24/2019
Double Height DDR4: 32GB Modules from G.Skill and ZADAK Reviewed
Two memory module companies, G.Skill and ZADAK, have developed a new memory format with double capacity DDR4 memory. These new modules put the equivalent of two standard modules onto...
52 by Ian Cutress & Gavin Bonshor on 1/23/2019
ASUS Z390 Platforms Now Support 128 GB of Memory
ASUS has released a new UEFI BIOS version for its ROG Maximus XI Hero motherboard that enables support of up to 128 GB of DDR4 memory platform using 32...
8 by Anton Shilov on 1/22/2019
CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs
GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...
3 by Anton Shilov on 1/14/2019
CES 2019: ADATA Spectrix Memory & SSDs Get More RGB
RGB lighting has become a major selling point for hardware aimed at gamers and performance enthusiasts. After all, since modern CPUs, GPUs, DRAMs, SSDs, and other components offer plenty...
4 by Anton Shilov on 1/14/2019
CES 2019: TeamGroup And ASRock Release Phantom Gaming Branded Memory and SSD
One of the leading players in memory Team Group has joined forces with ASRock to release the Phantom Gaming branded T-FORCE DELTA Phantom Gaming RGB SSD and T-FORCE XCALIBUR...
5 by Gavin Bonshor on 1/10/2019
CES 2019: Thermaltake Unveils Its WaterRAM RGB Liquid Cooled DDR4-3200 Memory
At CES 2019 Thermaltake officially entered the memory market with two new kits of DDR4 3200 RAM which not only include integrated water blocks but also includes 16.8 million...
13 by Gavin Bonshor on 1/9/2019
JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack
JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...
15 by Anton Shilov on 12/19/2018
Intel's Architecture Day 2018: The Future of Core, Intel GPUs, 10nm, and Hybrid x86
It has been hard to miss the fact that Intel has been vacuuming up a lot of industry talent, which brings with them a lot of experience. Renduchintala, Koduri...
149 by Dr. Ian Cutress on 12/12/2018
Apacer Launches 32-Bit SODIMM for Arm & RISC-V Systems
Apacer has announced a lineup of 32-bit SO-DIMMs designed for systems based on processors featuring Arm, RISC, or RISC-V architectures. The memory modules will enable SoC developers to take...
5 by Anton Shilov on 11/26/2018
Cadence Tapes Out GDDR6 IP on Samsung 7LPP Using EUV
Cadence has announced that it has successfully taped out its GDDR6 IP on Samsung’s 7LPP fabrication process. The new building blocks should enable developers of various chips to be...
11 by Anton Shilov on 11/26/2018
Your Highness: G.Skill Trident Z Royal, Bling Factor 11
G.Skill this week has officially introduced its Trident Z Royal family of memory modules. This memory featuring crystalline light bars with RGB lighting and polished heat spreaders. The modules...
4 by Anton Shilov on 11/20/2018
SK Hynix Reveals DDR4-3200 Memory Chips with 4 Phase Clocking
SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication...
4 by Anton Shilov on 11/16/2018
SK Hynix Develops First 16 Gb DDR5-5200 Memory Chip, Demos DDR5 RDIMM
SK Hynix on Thursday announced that it had completed development of its first DDR5 memory chip. The new chip offers a capacity of 16 Gb and is said to...
29 by Anton Shilov on 11/15/2018
G.Skill Unveils 64 GB DDR4-4266 and 128 GB DDR4-4000 Kits for HEDTs
Coinciding with today’s launch of Intel’s HEDT “Skylake-X/Basin Falls Refresh” family of CPUs, G.Skill today announced its new 64 GB DDR4-4266 and 128 GB DDR4-4000 kits designed for high-end...
1 by Anton Shilov on 11/13/2018
In The Lab: Double Capacity 2x32GB DDR4 from G.Skill and ZADAK
One of the interesting things to come out of the news in recent weeks is the march to double capacity memory. In today’s market, memory modules for consumer grade...
19 by Ian Cutress on 11/9/2018
SK Hynix Launches 96-Layer 3D NAND and Discloses QLC Plans
SK Hynix this week officially launched its new 96-layer 3D NAND flash memory chips, which feature a new architecture and a faster interface. The NAND has already been qualified...
4 by Anton Shilov on 11/8/2018
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