Micron
Following the magnitude 7.2 earthquake that struck Taiwan on April 3, 2024, there was immediate concern over what impact this could have on chip production within the country. Even for a well-prepared country like Taiwan, the tremor was the strongest quake to hit the region in 25 years, making it no small matter. But, according to research compiled by TrendForce, the impact on the production of DRAM will not be significant. The market tracking company believes that Taiwanese DRAM industry has remained largely unaffected, primarily due to their robust earthquake preparedness measures. There are four memory makers in Taiwan: Micron, the sole member of the "big three" memory manufacturers on the island, runs two fabs. Meanwhile among the smaller players is Nanya (which has one...
ASML High-NA Development Update: Coming to Fabs in 2024 - 2025
It took the semiconductor industry over a decade to prep everything needed for production of chips using extreme ultraviolet (EUV) lithography. It looks like it is going to take...
8 by Anton Shilov on 5/26/2022
DDR5 Demystified - Feat. Samsung DDR5-4800: A Look at Ranks, DPCs, and Do Manufacturers Matter?
The hottest advancement in memory technology for desktop computers in recent years is undoubtedly the release of DDR5 memory and Intel's 12th Gen Core series of processors. Not only...
68 by Gavin Bonshor on 4/7/2022
Kingston XS2000 Portable SSDs Review: USB 3.2 Gen 2x2 Goes Mainstream
Flash-based portable drives have become popular fast storage options for both content creators and backups-seeking consumers. The advent of high-speed interfaces such as USB 3.2 Gen 2 (10 Gbps...
19 by Ganesh T S on 11/10/2021
Kingston KC3000 PCIe 4.0 NVMe Flagship SSD Hits Retail
Kingston had previewed their 2021 flagship PCIe 4.0 x 4 M.2 NVMe SSD (codename "Ghost Tree") at CES earlier this year. Not much was divulged other than the use...
9 by Ganesh T S on 10/25/2021
Micron Announces PCIe 4.0 Client SSDs
In Micron's keynote today at (virtual) Computex, the memory manufacturer announced they have started shipping the companies first PCIe 4.0 SSDs, using their latest 176-layer 3D TLC NAND flash...
30 by Billy Tallis on 6/1/2021
Micron Abandons 3D XPoint Memory Technology
In a sudden but perhaps not too surprising announcement, Micron has stated that they are ceasing all R&D of 3D XPoint memory technology. Intel and Micron co-developed 3D XPoint...
60 by Billy Tallis on 3/16/2021
Crucial X6 Portable SSD 4TB Launches at $490: Phison's U17 Flash Controller Enters Retail
Crucial introduced the X6 Portable SSD last year as an entry-level alternative to their NVMe-based X8 Portable SSD. Launched in capacities of up to 2TB, the X6 adopted a...
1 by Ganesh T S on 3/2/2021
Micron Announces 176-layer 3D NAND
Just in time for Flash Memory Summit, Micron is announcing their fifth generation of 3D NAND flash memory, with a record-breaking 176 layers. The new 176L flash is their...
29 by Billy Tallis on 11/9/2020
Crucial Portable SSD X6 and X8 2TB Review: QLC for Storage On-the-Go
Bus-powered portable flash-based storage solutions are one of the growing segments in the consumer-focused direct-attached storage market. The emergence of 3D NAND with TLC and QLC has brought down...
22 by Ganesh T S on 10/21/2020
Insights into DDR5 Sub-timings and Latencies
Today we posted a news article about SK hynix’s new DDR5 memory modules for customers – 64 GB registered modules running at DDR5-4800, aimed at the preview systems that...
87 by Dr. Ian Cutress on 10/6/2020
ADATA External and HP Portable SSDs Review: Featuring the ADATA SE800 and HP P700
Portable flash-based storage solutions are one of the growing segments in the direct-attached storage market. The emergence of 3D NAND with TLC and QLC has brought down the cost...
13 by Ganesh T S on 9/24/2020
Crucial Launches X6 Portable SSD, Updates X8 with 2TB Model: QLC Drives for the Budget-Conscious
Crucial introduced their first bus-powered direct-attached storage product last year - the X8 Portable SSD. The product put their P1 NVMe SSD behind an ASMedia bridge to offer read...
8 by Ganesh T S on 8/25/2020
Micron Spills on GDDR6X: PAM4 Signaling For Higher Rates, Coming to NVIDIA’s RTX 3090
It would seem that Micron this morning has accidentally spilled the beans on the future of graphics card memory technologies – and outed one of NVIDIA’s next-generation RTX video...
68 by Ryan Smith on 8/20/2020
Memblaze Releases New PBlaze5 520 Series Low-Power Enterprise SSDs
Yesterday we saw Memblaze introducing a new series of low-power server-class NVMe SSDs that focus on providing excellent performance whilst maintaining lower power consumption levels, aiming at enterprises improving...
3 by Andrei Frumusanu on 7/30/2020
Crucial Announces P5 and P2 NVMe SSDs: Going In-House for the High-End
Micron's consumer brand Crucial has introduced two new NVMe SSD product lines, including their first high-end NVMe SSD which features Micron's in-house SSD controller design. However, Crucial's adoption of...
31 by Billy Tallis on 4/23/2020
Micron to Start Volume Production of 128-Layer 3D NAND with RG Architecture This Quarter
As part of the company's second quarter financial earnings call, Micron has revealed that it is about to start volume production of its 4th Generation 3D NAND memory devices...
10 by Anton Shilov on 4/1/2020
Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development
JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...
20 by Anton Shilov on 3/27/2020
Micron to Launch HBM2 DRAM This Year: Finally
Bundled in their latest earnings call, Micron has revealed that later this year the company will finally introduce its first HBM DRAM for bandwidth-hungry applications. The move will enable...
14 by Anton Shilov on 3/27/2020
Intel & Micron Sign New 3D XPoint Wafer Supply Agreement
Intel and Micron have inked a new 3D XPoint memory wafer supply agreement. Analysts believe that Intel will now have to pay Micron more than it did previously as...
20 by Anton Shilov on 3/16/2020
Micron Develops uMCP with LPDDR5 & 96L 3D NAND for Midrange 5G Smartphones
Micron this week has announced that it has started sampling the industry’s first multichip package (MCP) that integrates LPDDR5-6400 DRAM and 96-layer 3D NAND flash memory. The uMCP5 device...
11 by Anton Shilov on 3/11/2020
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