Yangtze Memory Technologies Co. (YMTC) has announced that it's developed its new 128-layer 1.33 Tb QLC 3D NAND memory chip, the X2-6070. The new chip is based on its Xtacking architecture which enables it to run with super high I/O while maximising the density of its memory arrays. YMTC has also unveiled its plan for a 128-layer 512 Gb TLC chip, the X2-9060, designed to meet more diverse application requirements. We first reported on the China-based company YMTC entering its 3D NAND memory chips into production back in 2018, when it unveiled its Xtacking Architecture at the Flash Memory Summit. While it didn't disclose technical details of its announcement, it did state the Xtacking architecture has the capability to run the I/O with speeds of...
Yangtze Memory Unveils Xtacking Architecture for 3D NAND: Up to 3 Gbps I/O
Yangtze Memory Technologies Co. (YMTC) on Monday unveiled key details regarding its Xtacking architecture that will be used for its upcoming 3D NAND flash memory chips. The company's technology...7 by Anton Shilov on 8/6/2018