TSMC

The announcement of the new Ryzen 5000 processors, built on AMD’s Zen 3 microarchitecture, has caused waves of excitement and questions as to the performance. The launch of the high-performance desktop processors on November 5th will be an interesting day. In advance of those disclosures, we sat down with AMD’s CTO Mark Papermaster to discuss AMD’s positioning, performance, and outlook.

AMD Zen 3 Announcement by Lisa Su: A Live Blog at Noon ET (16:00 UTC)

One of the most anticipated launches of 2020 is now here. AMD's CEO, Dr. Lisa Su, is set to announce and reveal the new Ryzen 5000 series processors using...

90 by Dr. Ian Cutress on 10/8/2020

3DFabric: The Home for TSMC’s 2.5D and 3D Stacking Roadmap

Interposers. EMIB. Foveros. Die-to-die stacking. ODI. AIB.TSVs. All these words and acronyms have one overriding feature – they are all involved in how two bits of silicon physically connect...

13 by Dr. Ian Cutress on 9/2/2020

TSMC Launches New N12e Process: FinFET at 0.4V for IoT

One of the main drivers for the semiconductor industry is the growth in always-connected devices that require silicon inside, either for compute, communication, or control. The ‘Internet of Things&rsquo...

27 by Dr. Ian Cutress on 8/27/2020

TSMC: We have 50% of All EUV Installations, 60% Wafer Capacity

One of the overriding central messages to TSMC’s Technology Symposium this week is that the company is a world leader in semiconductor manufacturing, especially at the leading edge process...

34 by Dr. Ian Cutress on 8/27/2020

TSMC and Graphcore Prepare for AI Acceleration on 3nm

One of the side announcements made during TSMC’s Technology Symposium was that it already has customers on hand with product development progressing for its future 3nm process node technology...

2 by Dr. Ian Cutress on 8/27/2020

Where are my GAA-FETs? TSMC to Stay with FinFET for 3nm

As we passed that 22nm to 16nm barrier, almost all the major semiconductor fabrication companies on the leading edge transitioned from planar transistors to FinFET transistors. The benefits of...

36 by Dr. Ian Cutress on 8/26/2020

2023 Interposers: TSMC Hints at 3400mm2 + 12x HBM in one Package

High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the...

35 by Andrei Frumusanu on 8/25/2020

TSMC Expects 5nm to be 11% of 2020 Wafer Production (sub 16nm)

One of the measures of how quickly a new process node gains traction is by comparing how many wafers are in production, especially as that new process node goes...

13 by Dr. Ian Cutress on 8/25/2020

TSMC’s Version of EMIB is ‘LSI’: Currently in Pre-Qualification

Whilst process node technologies and Moore’s Law are slowing down, manufacturers and chip designers are looking to new creative solutions to further enable device and performance scaling. Advanced packaging...

19 by Andrei Frumusanu on 8/25/2020

TSMC Teases 12-High 3D Stacked Silicon: SoIC Goes Extreme

I’ve maintained for a couple of years now that the future battleground when it comes to next-generation silicon is going to be in the interconnect – implicitly this relies...

16 by Dr. Ian Cutress on 8/25/2020

TSMC Details 3nm Process Technology: Full Node Scaling for 2H22 Volume Production

At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the...

57 by Andrei Frumusanu on 8/24/2020

TSMC Confirms Halt to Huawei Shipments In September

TSMC on Thursday has confirmed that it had stopped processing new orders from Huawei back on May 15th. The news is the first official statement from the company on...

72 by Andrei Frumusanu on 7/17/2020

AMD Succeeds in its 25x20 Goal: Renoir Crosses the Line in 2020

One of the stories bubbling away in the background of the industry is the AMD self-imposed ‘25x20’ goal. Starting with performance in 2014, AMD committed to itself, to customers...

83 by Dr. Ian Cutress on 6/25/2020

Ampere’s Product List: 80 Cores, up to 3.3 GHz at 250 W; 128 Core in Q4

With the advent of higher performance Arm based cloud computing, a lot of focus is being put on what the various competitors can do in this space. We’ve covered...

18 by Dr. Ian Cutress on 6/23/2020

New #1 Supercomputer: Fugaku in Japan, with A64FX, take Arm to the Top with 415 PetaFLOPs

High performance computing is now at a point in its existence where to be the number one, you need very powerful, very efficient hardware, lots of it, and lots...

46 by Dr. Ian Cutress on 6/22/2020

Russia’s Elbrus 8CB Microarchitecture: 8-core VLIW on TSMC 28nm

All of the world’s major superpowers have a vested interest in building their own custom silicon processors. The vital ingredient to this allows the superpower to wean itself off...

92 by Dr. Ian Cutress on 6/1/2020

TSMC To Build 5nm Fab In Arizona, Set To Come Online In 2024

In a big shift to their manufacturing operations – and a big political win domestically – TSMC has announced that the company will be building a new, high-end fab...

100 by Ryan Smith on 5/15/2020

AMD Clarifies Comments on 7nm / 7nm+ for Future Products: EUV Not Specified

As part of AMD’s Financial Analyst Day 2020, the company gave the latest updates for its CPU and GPU roadmap. A lot of this we have seen before, with...

37 by Dr. Ian Cutress on 3/5/2020

AMD Discusses ‘X3D’ Die Stacking and Packaging for Future Products: Hybrid 2.5D and 3D

One of AMD’s key messages at its Financial Analyst Day 2020 is that the company wants to remain on the leading edge when it comes to process node technology...

12 by Dr. Ian Cutress on 3/5/2020

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